Semiconductor device and fabrication method thereof

ABSTRACT

A semiconductor device includes a substrate, a first gate structure on the substrate, a first spacer adjacent to the first gate structure, a lower contact plug adjacent to the first gate structure and contact the first spacer, and a first overhang feature disposed on an upper end of the first spacer.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of Taiwan patent application No.104128778, filed on Sep. 1, 2015, the disclosure of which isincorporated herein in its entirety by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a semiconductor device and,more particularly, to a low-resistance contact structure and a method ofmaking the same.

2. Description of the Prior Art

As the size of the integrated circuit devices continues to scale down,the polysilicon gate and the silicon dioxide insulating layer of ametal-oxide-semiconductor field effect transistor (MOSFET) structurehave been confronted with the physical limits of the material itself. Tomeet the demands of scalability, it is necessary to incorporate high-kmetal gate (HK/MG) process.

Today, two main integration options remain: gate-first (often referredto as MIPS, metal inserted poly-silicon) and gate-last (also called RMG,replacement metal gate). The terminology “first” and “last” refers towhether the metal electrode is deposited before or after the hightemperature activation anneal of the flow. The replacement metal gate(RMG) process flow allows the use of aluminum as a conductor material.

Typically, the M₀ contact is fabricated after the RMG process.Currently, a so-called Self-Aligned Contact (SAC) is employed. However,this technical field still encounters some problems even after the SACtechnique and metal gate scheme are introduced.

For example, as the gap between the gate structures is less than acertain dimension, e.g., 10 nm, the SAC structure manufactured byexisting processes may not satisfy the electrical requirements. Processmisalignment leads to laterally offset of the SAC structure. When theSAC structure deviates from a predetermined position, the contact areabetween the SAC structure and the active region below will be reduced,resulting in significant increase of contact resistance (Rc).

SUMMARY OF THE INVENTION

The present invention proposes a low-resistance contact structure andits manufacturing method that is compatible with replacement metal gate(RMG) processes, thereby solving the above-mentioned shortcomings anddisadvantages of the prior art.

According to one embodiment of the invention, a semiconductor deviceincludes a substrate, a first gate structure on the substrate, a firstspacer adjacent to the first gate structure, a lower contact plugadjacent to the first gate structure, and a first overhang featuredisposed on an upper end of the first spacer.

According to one embodiment of the invention, the semiconductor devicefurther includes a second gate structure on the substrate, a secondspacer adjacent to the second gate structure, and a second overhangfeature disposed on an upper end of the second spacer. The lower contactplug is situated between the first gate structure and the second gatestructure. The lower contact plug contacts the first spacer and thesecond spacer. The lower contact plug has a bottle-shaped profilebetween the first spacer and the second spacer.

According to one embodiment of the invention, the semiconductor devicefurther includes an interlayer dielectric (ILD) layer on the first gatestructure, the second gate structure, the first overhang feature, andthe second overhang feature, and at least an upper contact plug in theILD layer and directly above the lower contact plug. The upper contactplug is electrically connected to the lower contact plug.

According to one embodiment of the invention, a method for fabricating asemiconductor device is provided. A substrate having a dummy gatethereon is prepared. A spacer is disposed on a sidewall of the dummygate. A source/drain region is disposed adjacent to the dummy gate. Asacrificial layer is then formed on the source/drain region. A cap layeris then formed on the sacrificial layer. A top surface of the cap layeris coplanar with a top surface of the dummy gate. A replacement metalgate (RMG) process is performed to transform the dummy gate into areplacement metal gate. An opening is then formed in the cap layer toexpose a top surface of the sacrificial layer. The sacrificial layer isremoved through the opening, thereby forming a lower contact holeexposing a top surface of the source/drain region. A lower contact plugis then formed in the lower contact hole.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the embodiments, and are incorporated in and constitutea part of this specification. The drawings illustrate some of theembodiments and, together with the description, serve to explain theirprinciples. In the drawings:

FIG. 1 to FIG. 8 are schematic, cross-sectional diagrams showing anexemplary method of fabricating a contact structure in accordance withone embodiment of the invention; and

FIG. 9 is a schematic, cross-sectional diagram showing a contactstructure in accordance with another embodiment of the invention.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shown,by way of illustration of specific embodiments in which the inventionmay be practiced. These embodiments are described in sufficient detailto enable those skilled in the art to practice the invention. Otherembodiments may be utilized and that structural, logical and electricalchanges may be made without departing from the spirit and scope of thepresent invention. The following detailed description is, therefore, notto be taken in a limiting sense, and the scope of the present inventionis defined by the appended claims, along with the full scope ofequivalents to which such claims are entitled.

Briefly, the present invention pertains to a method of fabricating acontact plug or contact structure, which involves the replacement metalgate (RMG) process. Prior to the RMG process, a dummy amorphous silicon(dummy a-Si) layer is buried into a gap between gate structures. Thedummy a-Si layer is then covered with a HDP oxide layer. After the RMGprocess, an M₀ contact replacement process for forming the contactstructure is performed. The dummy a-Si layer buried in the gap betweengate structures is replaced with a metal layer, thereby forming alow-resistance M₀ contact structure.

Please refer to FIG. 1 to FIG. 8. FIG. 1 to FIG. 8 are schematic,cross-sectional diagrams showing an exemplary method of fabricating acontact structure in accordance with one embodiment of the invention.First, as shown in FIG. 1, a substrate 10 is provided. For example, thesubstrate 10 may comprise a semiconductor substrate or a siliconsubstrate, but not limited thereto. According to one embodiment of theinvention, the substrate 10 may comprise a plurality of fin structures(not explicitly shown).

Subsequently, at least two adjacent dummy gate structures 20 and 30 areformed on a main surface of the substrate 10. According to oneembodiment of the invention, the dummy gate structure 20 comprises atleast a sacrificial layer 201 and a cap layer 202. For example, thesacrificial layer 201 may comprise amorphous silicon or polysilicon, andthe cap layer 202 may comprise silicon nitride, but not limited thereto.A gate dielectric layer 203 may be disposed between the sacrificiallayer 201 and the substrate 10. A gate dielectric layer 303 may bedisposed between the sacrificial 301 and the substrate 10. The gatedielectric layers 203, 303 may comprise, for example, silicon dioxide,but not limited thereto.

According to one embodiment of the invention, the two adjacent dummygate structures 20 and 30 may be straight-line shaped and parallel toeach other. According to one embodiment of the invention, the twoadjacent dummy gate structures 20 and 30 may traverse the fin structures(not explicitly shown) of the substrate 10.

According to one embodiment of the invention, at least one spacer 205,for example, a silicon nitride spacer, may be formed on either sidewallof the dummy gate structure 20, but not limited thereto. At least onespacer 305, for example, a silicon nitride spacer, may be formed oneither sidewall of the dummy gate structure 30, but not limited thereto.

According to one embodiment of the invention, a conductive region 110,for example, a heavily doped source/drain region, may be disposed in thesubstrate 10, but not limited thereto. According to one embodiment ofthe invention, the conductive region 110 may comprise an epitaxial layer(not explicitly shown), for example, SiGe epitaxial layer or SiPepitaxial layer, but not limited thereto. According to one embodiment ofthe invention, a lightly doped drain (LDD) region 120 may be disposed inthe substrate 10. The LDD region 120 may be disposed directly under thespacer 205 or spacer 305.

Optionally, according to one embodiment of the invention, a contact etchstop layer (not shown) such as a silicon nitride thin film may beconformally formed on the dummy gate structures 20, 30 and theconductive region 110.

According to one embodiment of the invention, a gap 40 is formed betweenthe two adjacent dummy gate structures 20 and 30. A top surface of theconductive region 110 is exposed at the bottom of the gap 40. Aspreviously mentioned, the gap 40 continues to shrink with advances inthe semiconductor technology. Therefore, the surface area of theconductive region 110 exposed at the bottom of the gap 40 becomessmaller and smaller. For the 14 nm technology nodes or beyond, even veryslight shift of the self-aligned contact may lead to significantincrease of contact resistance (Rc). The present invention addressesthis issue.

As shown in FIG. 2, according to one embodiment of the invention, asacrificial layer 50 is deposited into the gap 40. The sacrificial layer50 may comprise amorphous silicon (a-Si), but not limited thereto. Thesacrificial layer 50 has a top surface 50 a that is lower than topsurfaces of the dummy gate structures 20 and 30. To form the sacrificiallayer 50, for example, a chemical vapor deposition (CVD) process isperformed to deposit a material layer such as an amorphous silicon layerin a blanket manner. The material layer completely fills up the gap 40.A chemical mechanical polishing (CMP) process or an etching back processis then carried out to remove a portion of the material layer. A portionof the material layer is left within the gap 40, thereby forming thesacrificial layer 50.

As shown in FIG. 3, the sacrificial layer 50 is covered with a cap layer60, for example, a high-density plasma (HDP) oxide layer. The cap layer60 and the sacrificial layer 50 together fill up the gap 40. Accordingto one embodiment of the invention, to form the cap layer 60, forexample, a high-density plasma CVD (HDPCVD) process is performed todeposit an HDP oxide in a blanket manner. The HDP oxide layer covers thedummy gate structures 20 and 30, and fills into the gap 40 to therebycover the sacrificial layer 50. A CMP process is performed to remove aportion of the HDP oxide layer until the cap layers 202 and 302 of thedummy gate structures 20 and 30 are revealed. The remaining portion ofthe HDP oxide layer is left in the gap 40.

As shown in FIG. 4, subsequently, a replacement metal gate (RMG) processis performed. For example, the dummy gate structures 20 and 30 includingthe sacrificial layers 201, 301 and the cap layers 202, 302 are removed,thereby forming gate trenches 220 and 320. Thereafter, high-k dielectriclayer 221, 321, replacement metal gates 222, 322, and cap layers 223,323 are formed within the gate trenches 220, 320, respectively, tothereby form replacement gate structures 20′ and 30′.

According to one embodiment of the invention, for example, the high-kdielectric layers 221, 321 may be composed of a material selected fromthe group including hafnium oxide (HfO₂), hafnium silicon oxide(HfSiO₄), hafnium silicon oxynitride (HfSiON), aluminum oxide (Al₂O₃),lanthanum oxide (La₂O₃), tantalum oxide (Ta₂O₅), yttrium oxide (Y₂O₃),zirconium oxide (ZrO₂), strontium titanate oxide (SrTiO₃), zirconiumsilicon oxide (ZrSiO₄), hafnium zirconium oxide (HfZrO₄), strontiumbismuth tantalate (SrBi₂Ta₂O₉, SBT), lead zirconate titanate(PbZr_(x)Ti_(1-x)O₃, PZT), and barium strontium titanate(Ba_(x)Sr_(1-x)TiO₃, BST).

According to one embodiment of the invention, for example, thereplacement metal gate 222, 322 maybe multi-layer structure and maycomprise, from bottom to top, a bottom barrier layer, a metal layer withdesired work function, a top barrier layer and a main conducting layer.The bottom barrier layer may comprise a single or composite layercomprising tantalum nitride (TaN) or titanium nitride (TiN), etc. Themetal layer may comprise a single or a composite layer with desired workfunction, which meets the transistor's requirement. The metal layer maybe composed of a material selected from the group including titaniumnitride (TiN), titanium carbide (TiC), tantalum nitride (TaN), tantalumcarbide (TaC), tungsten carbide (WC), titanium aluminide (TiAl),aluminum titanium nitride (TiAlN), etc. The top barrier layer maycomprise a single or composite layer comprising tantalum nitride (TaN)or titanium nitride (TiN), etc. The main conducting layer may comprisealuminum, tungsten, titanium aluminum alloy (TiAl), cobalt tungstenphosphide (CoWP), or other materials with low resistance.

According to one embodiment of the invention, the cap layers 223, 323may comprise, for example, silicon nitride, but not limited thereto. Atthis point, the cap layers 223, 323 may have top surfaces that are flushwith a top surface 60 a of the cap layer 60. Alternatively, the topsurface 60 a of the cap layer 60 may be slightly lower than the topsurfaces of the cap layers 223, 323.

As shown in FIG. 5, after the RMG process, a photoresist (or etchingresist) pattern 70 is formed on the top surface 60 a of the cap layer 60and the top surfaces of the cap layers 223, 323. The photoresist pattern70 includes an opening 70 a that exposes a portion of the top surface 60a of the cap layer 60. The opening 70 a may be located directly abovethe conductive region 110. According to one embodiment of the invention,the opening 70 a may have a width that is smaller than a width of theconductive region 110, but not limited thereto. Subsequently, an etchingprocess is performed to etch the cap layer 60 through the opening 70 a,thereby forming an opening 602 in the cap layer 60. The opening 602exposes a portion of the top surface 50 a of the sacrificial layer 50.Thereafter, the photoresist pattern 70 is removed.

According to one embodiment of the invention, the remaining cap layers60 situated on the upper ends of the spacers 205, 305 constituteoverhang features 60 b. The overhang features 60 b may compensate theinadequate thickness at the upper ends of the spacers 205, 305, therebyimproving the electrical performance.

As shown in FIG. 6, an etching process such as a wet etching process isperformed to selectively etch away the sacrificial layer 50 through theopening 602, thereby forming a widened opening 502 under the opening602. The widened opening 502 exposes the lower surfaces of the spacers205, 305 under the overhang features 60 b, and reveals the entiresurface of the conductive region 110. According to one embodiment of theinvention, the opening 602 and the widened opening 502 constitute abottle-shaped opening (or lower contact hole) 600. At this point, anundercut 605 is formed between the overhang features 60 b and thespacers 205, 305.

According to one embodiment of the invention, if a contact etch stoplayer (not shown) such as a silicon nitride layer is formed on thespacers 205, 305 and the conductive region 110, another etching processmay be performed after etching the sacrificial layer 50 to remove thecontact etch stop layer from the conductive region 110.

As shown in FIG. 7, subsequently, a CVD process such as atomic layerdeposition (ALD) or the like may be performed to conformally deposit aglue layer 802 on the interior surface of the opening 600, including thesurfaces of the overhang features 60 b and the spacers 205, 305, and thesurface of the conductive region 110. According to one embodiment of theinvention, the glue layer 802 may include, but not limited to, titanium(Ti) or titanium nitride (TiN). According to one embodiment of theinvention, the glue layer 802 maybe deposited outside the opening 600,for example, the top surfaces of the cap layers 223, 323.

Subsequently, another deposition process is performed to form alow-resistance conductive layer 804, for example, tungsten (W) layer, onthe glue layer 802. According to one embodiment of the invention, thelow-resistance conductive layer 804 fills up the opening 600. A chemicalmechanical polishing (CMP) process is performed to remove the glue layer802 and the low-resistance conductive layer 804 outside the opening 600.The remaining glue layer 802 and the low-resistance conductive layer 804inside the opening 600 constitute a lower contact plug 800. According toone embodiment of the invention, the lower contact plug 800 has a shapethat conforms to the bottle-shape of the opening 600. The lower contactplug 800 has a narrower top portion and a wider bottom portion.

As shown in FIG. 8, subsequently, an inter-layer dielectric (ILD) layer90 such as a silicon oxide layer is deposited in a blanket manner. TheILD layer 90 covers the lower contact plug 800 and the cap layers 223,323. Subsequently, lithographic and etching processes are performed toform an opening (or upper contact hole) 90 a in the ILD layer 90. Theopening 90 a may be located directly above the lower contact plug 800and expose a top surface of the lower contact plug 800.

Subsequently, a CVD process such as ALD process or other suitabledeposition processes may be performed to conformally deposit a gluelayer 902 on the interior surface of the opening 90 a and on the surfaceof the ILD layer 90. According to one embodiment of the invention, theglue layer 902 may include, but not limited to, Ti or TiN. Anotherdeposition process is then performed to form a low-resistance conductivelayer 904 such as tungsten layer on the glue layer 902. According to oneembodiment of the invention, the opening 90 a is filled up with thelow-resistance conductive layer 904. A CMP process may be performed toremove the glue layer 902 and the low-resistance conductive layer 904outside the opening 90 a. The remaining glue layer 902 and thelow-resistance conductive layer 904 inside the opening 90 a constitutean upper contact plug 900. The upper contact plug 900 and the lowercontact plug constitute the present invention low-resistance contactstructure.

Structurally, as shown in FIG. 8, one embodiment of the inventiondiscloses a semiconductor device 1 including a substrate 10, a firstgate structure 20′ on the substrate 10, a first spacer 205 adjacent tothe first gate structure 20′, a lower contact plug 800 adjacent to thefirst gate structure 20′ and contact the first spacer 205, and a firstoverhang feature 60 b disposed on an upper end of the first spacer 205.An undercut structure 605 is located between the first overhang feature60 b and the first spacer 205. The lower contact plug 800 comprises afirst tungsten layer and a first glue layer 802.

According to one embodiment of the invention, the semiconductor device 1further includes a second gate structure 30′ on the substrate 10, asecond spacer 305 adjacent to the second gate structure 30′, and asecond overhang feature 60 b disposed on an upper end of the secondspacer 305. The lower contact plug 800 is situated between the firstgate structure 20′ and the second gate structure 30′. The lower contactplug 800 contacts the first spacer 205 and the second spacer 305. Thelower contact plug 800 has a bottle-shaped profile between the firstspacer 205 and the second spacer 305.

According to one embodiment of the invention, the semiconductor device 1further includes an inter-layer dielectric (ILD) layer 90 covering thefirst gate structure 20′, the second gate structure 30′, the firstoverhang feature 60 b, and the second overhang feature 60 b, and atleast an upper contact plug 900 in the ILD layer 90. The upper contactplug 900 is situated directly above the lower contact plug 800 and iselectrically connected to the lower contact plug 800.

It is to be understood that the upper contact plug 900 may be formeddirectly on the first gate structure 20′ or the second gate structure30′ to electrically connect to the first gate structure 20′ or thesecond gate structure 30′, which is not shown in this figure.

FIG. 9 is a schematic, cross-sectional diagram showing a contactstructure in accordance with another embodiment of the invention. Asshown in FIG. 9, and briefly back to FIG. 6, after depositing the gluelayer 802 and the low-resistance conductive layer 804 inside the opening600, a CMP process is performed to remove the glue layer 802 and thelow-resistance conductive layer 804 outside the opening 600. Theremaining glue layer 802 and the low-resistance conductive layer 804constitute the lower contact plug 800. By adjusting the parameters ofthe CMP process, a convex top surface 800 a of the low-resistanceconductive layer 804 is obtained.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A semiconductor device, comprising: a substrate; a first gatestructure on the substrate; a first spacer adjacent to the first gatestructure; a lower contact plug adjacent to the first gate structure andcontact the first spacer; and a first overhang feature only disposed onan upper end of the first spacer.
 2. The semiconductor device accordingto claim 1, wherein the lower contact plug comprises a first tungstenlayer and a first glue layer.
 3. The semiconductor device according toclaim 2, wherein the first glue layer is disposed between the firsttungsten layer and the first spacer.
 4. The semiconductor deviceaccording to claim 2, wherein the first glue layer is disposed betweenthe first tungsten layer and the first overhang feature.
 5. Thesemiconductor device according to claim 2, wherein the first glue layercomprise Ti or TiN.
 6. The semiconductor device according to claim 1,wherein the first overhang feature comprises silicon oxide.
 7. Thesemiconductor device according to claim 1, wherein a top surface of thefirst overhang feature is coplanar with a top surface of the first gatestructure.
 8. The semiconductor device according to claim 1, wherein thelower contact plug comprises a narrower top portion and a wider bottomportion.
 9. The semiconductor device according to claim 8, furthercomprising an undercut between the first overhang feature and the firstspacer, wherein the wider bottom portion is disposed within theundercut.
 10. The semiconductor device according to claim 1 furthercomprising: a second gate structure on the substrate; a second spaceradjacent to the second gate structure; and a second overhang featureonly disposed on an upper end of the second spacer; wherein the lowercontact plug is situated between the first gate structure and the secondgate structure, wherein the lower contact plug contacts the first spacerand the second spacer, wherein the lower contact plug has abottle-shaped profile with a narrower top portion and a wider bottomportion between the first spacer and the second spacer.
 11. Thesemiconductor device according to claim 10 further comprising: aninterlayer dielectric (ILD) layer on the first gate structure, thesecond gate structure, the first overhang feature, and the secondoverhang feature; and at least an upper contact plug in the ILD layerand directly above the lower contact plug, wherein the upper contactplug is electrically connected to the lower contact plug.
 12. Thesemiconductor device according to claim 11 further comprising: a secondglue layer between the upper contact plug and the lower contact plug.13. The semiconductor device according to claim 12, wherein the secondglue layer comprise Ti or TiN.
 14. A method for fabricating asemiconductor device, comprising: providing a substrate having a dummygate thereon, a spacer on a sidewall of the dummy gate, and asource/drain region adjacent to the dummy gate; forming a sacrificiallayer on the source/drain region; forming a cap layer on the sacrificiallayer, wherein a top surface of the cap layer is coplanar with a topsurface of the dummy gate; performing a replacement metal gate (RMG)process to transform the dummy gate into a replacement metal gate;forming an opening in the cap layer to expose a top surface of thesacrificial layer; removing the sacrificial layer through the opening tothereby form a lower contact hole exposing a top surface of thesource/drain region; and forming a lower contact plug in the lowercontact hole.
 15. The method for fabricating a semiconductor deviceaccording to claim 14, further comprising: depositing an inter-layerdielectric (ILD) layer on the replacement metal gate, the cap layer, andthe lower contact plug; and forming an upper contact plug in the ILDlayer, wherein the upper contact plug is electrically connected to thelower contact plug.
 16. The method for fabricating a semiconductordevice according to claim 14, wherein the sacrificial layer comprisesamorphous silicon.
 17. The method for fabricating a semiconductor deviceaccording to claim 16, wherein the cap layer comprises silicon oxide.18. The method for fabricating a semiconductor device according to claim16, wherein the cap layer comprises HDP oxide.
 19. The method forfabricating a semiconductor device according to claim 14, wherein thereplacement metal gate comprises a bottom barrier layer, a metal layerwith desired work function, a top barrier layer, and a main conductinglayer.
 20. The method for fabricating a semiconductor device accordingto claim 14, wherein the lower contact plug comprises a tungsten layerand a glue layer.